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IEC 63251:2023 ED1

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
1. 11. 2023.

Опште информације

60.60     1. 11. 2023.

IEC

TC 91

Međunarodni standard

31.180  

engleski   francuski  

Kupovina

Objavljen

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Apstrakt

IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 63251:2023 ED1
60.60 Standard objavljen
1. 11. 2023.

Nacionalna preuzimanja

SRPS EN IEC 63251:2024  
ISS

Metoda ispitivanja mehaničkih svojstava savitljivih optičkih električnih štampanih ploča pri termičkom naprezanju

60.60   Standard objavljen

N040 Saznaj više