Zamenjen
Defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. Provides users with an acoustic microscopy process flow for detecting anomalies (delamination, cracks, mold compounds voids, etc.) nondestructively in plastic packages while achieving reproducibility.
POVUČEN
IEC PAS 62191:2000 ED1
95.99
Povučen
31. 1. 2002.
POVUČEN
IEC 60749:1996/AMD2:2001 ED2