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IEC 62769-4:2023 ED3

Field Device Integration (FDI®) - Part 4: FDI Packages
5. 4. 2023.

Опште информације

60.60     5. 4. 2023.

IEC

TC 65/SC 65E

Međunarodni standard

25.040.40     35.100.05  

engleski  

Kupovina

Objavljen

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Apstrakt

IEC 62769-4:2023 specifies the FDI®[1] Packages. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Architecture diagram figure.

[1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

Životni ciklus

PRETHODNO

POVUČEN
IEC 62769-4:2021 ED2

TRENUTNO

OBJAVLJEN
IEC 62769-4:2023 ED3
60.60 Standard objavljen
5. 4. 2023.

Nacionalna preuzimanja

SRPS EN IEC 62769-4:2023  
ISS

Integracija uređaja na terenu (FDI®) – Deo 4: FDI paketi

60.60   Standard objavljen

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