IEC 60749-9:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

Datum objavljivanja: 12. 4. 2002.

Опште информације

Trenutna faza: 99.60 Effective date: 3. 3. 2017.

Sledeća faza: WPUB

Inicijator: IEC

Pripada: TC 47

Vrsta: Međunarodni standard

ICS: 31.080.01

Jezik: engleski francuski španski

Kupovina

Status: Revidiran

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Apstrakt

Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process.
This test is applicable for all package types. The test should be considered non-destructive.

The contents of the corrigendum of August 2003 have been included in this copy.

Životni ciklus

PRETHODNO

POVUČEN
IEC 60749:1996 ED2

POVUČEN
IEC 60749:1996/AMD1:2000 ED2

POVUČEN
IEC 60749:1996/AMD2:2001 ED2

POVUČEN
IEC PAS 62175:2000 ED1

TRENUTNO

POVUČEN
IEC 60749-9:2002 ED1
99.60 Povlačenje stupilo na snagu
3. 3. 2017.

ISPRAVKE / IZMENE

POVUČEN
IEC 60749-9:2002/COR1:2003 ED1

REVIDIRAN OD

OBJAVLJEN
IEC 60749-9:2017 ED2