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Glavni meni

IEC 60191-6-12:2002 ED1

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
14. 6. 2002.

Опште информације

99.60     8. 6. 2011.

IEC

TC 47/SC 47D

Međunarodni standard

31.080.01  

engleski   španski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.

Životni ciklus

TRENUTNO

POVUČEN
IEC 60191-6-12:2002 ED1
99.60 Povlačenje stupilo na snagu
8. 6. 2011.

REVIDIRAN OD

OBJAVLJEN
IEC 60191-6-12:2011 ED2