IEC 61760-1:2006 ED2

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

Datum objavljivanja: 10. 4. 2006.

Опште информације

Trenutna faza: 99.60 Effective date: 14. 7. 2020.

Sledeća faza: WPUB

Inicijator: IEC

Pripada: TC 91

Vrsta: Međunarodni standard

ICS: 31.240

Jezik: engleski francuski

Kupovina

Status: Revidiran

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Apstrakt

IEC 61760-1:2006-04(en-fr) gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The main changes with regard to the previous edition concern:
- requirements related to lead-free soldering;
- extension of the scope to include also components mounted by gluing;
- direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat;
- classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.

Životni ciklus

PRETHODNO

POVUČEN
IEC 61760-1:1998 ED1

TRENUTNO

POVUČEN
IEC 61760-1:2006 ED2
99.60 Povlačenje stupilo na snagu
14. 7. 2020.

REVIDIRAN OD

OBJAVLJEN
IEC 61760-1:2020 ED3