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Glavni meni

IEC PAS 62307:2002 ED1

Test method for the measurement of moisture diffusivity and water solubility in organic materials used in integrated circuits
12. 3. 2002.

Опште информације

99.60     24. 7. 2006.

IEC

TC 47

Javno dostupna specifikacija

31.200  

engleski  

Kupovina

Zamenjen

Jezik na kome želite da primite dokument.

Apstrakt

Details the procedures for the measurement of characteristic bulk material properties of moisture diffusivity and water solubility in organic materials used in the packaging of IC components. These two material properties are important parameters for the effective reliability performance of plastic packaged ICs after exposure to moisture and subjected to high temperature solder reflow.

Životni ciklus

TRENUTNO

POVUČEN
IEC PAS 62307:2002 ED1
99.60 Povlačenje stupilo na snagu
24. 7. 2006.

REVIDIRAN OD

POVUČEN
IEC 60749-39:2006 ED1