Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br />
Part 2: Method for evaluating thermal conductivity of circuit boards with polymer composites by using finite element analysis and measurements
Metoda merenja koja se koristi kod projektovanja termike za montažu elektronskih elemenata – Deo 2: Metoda merenja termičke provodnosti štampanih ploča sa kompozitima od polimera