IEC 61760-4:2026 specifies the classification of moisture sensitive device into moisture sensitivity level related to soldering heat, and provisions for packaging, labelling and handling.
It extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases, this document introduces additional moisture sensitivity levels and an alternative method for packaging.
This document applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices, and devices for flow (wave) soldering.
NOTE Background of this document and its relation to currently existing standards, e.g. IEC 60749‑20 or J-STD-020F and J-STD-033, are described in the Introduction.
This edition includes the following significant technical changes with respect to the previous edition:
a) The content is updated to cover the classification conditions given in the new editions of J-STD-020F and IEC 60068-2-58.
