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IEC 60749-35:2006 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
18. 7. 2006.

Опште информације

60.60     18. 7. 2006.

IEC

TC 47

Međunarodni standard

31.080.01  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 60749-35:2006 ED1
60.60 Standard objavljen
18. 7. 2006.