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Glavni meni

IEC 62137-1-1:2007 ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
11. 7. 2007.

Опште информације

60.60     11. 7. 2007.

IEC

TC 91

Međunarodni standard

31.190  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 62137-1-1:2007 ED1
60.60 Standard objavljen
11. 7. 2007.