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Glavni meni

IEC 62137-1-2:2007 ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
25. 7. 2007.

Опште информације

60.60     25. 7. 2007.

IEC

TC 91

Međunarodni standard

31.190  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 62137-1-2:2007 ED1
60.60 Standard objavljen
25. 7. 2007.