IEC 60068-2-20:2008 ED5

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

Datum objavljivanja: 21. 7. 2008.

Опште информације

Trenutna faza: 99.60 Effective date: 30. 3. 2021.

Sledeća faza: WPUB

Inicijator: IEC

Pripada: TC 91

Vrsta: Međunarodni standard

ICS: 19.040

Jezik: engleski francuski

Kupovina

Status: Revidiran

PDF

Papir

PDF i papir

Jezik

Jezik na kome želite da primite dokument.

Apstrakt

IEC 60068-2-20:2008 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following:
- the solder globule test is deleted;
- test conditions and requirements for lead-free solders are added.

Životni ciklus

PRETHODNO

POVUČEN
IEC 60068-2-20:1979 ED4

POVUČEN
IEC 60068-2-20:1979/AMD2:1987 ED4

POVUČEN
IEC 60068-2-20:1979/AMD1:1986 ED4

TRENUTNO

POVUČEN
IEC 60068-2-20:2008 ED5
99.60 Povlačenje stupilo na snagu
30. 3. 2021.

REVIDIRAN OD

OBJAVLJEN
IEC 60068-2-20:2021 ED6