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Glavni meni

IEC 60191-6-17:2011 ED1

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
27. 1. 2011.

Опште информације

60.60     27. 1. 2011.

IEC

TC 47/SC 47D

Međunarodni standard

31.080.01  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 60191-6-17:2011 ED1
60.60 Standard objavljen
27. 1. 2011.