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Glavni meni

IEC 62137-1-4:2009 ED1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
26. 1. 2009.

Опште информације

60.60     26. 1. 2009.

IEC

TC 91

Međunarodni standard

31.190  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 62137-1-4:2009 ED1
60.60 Standard objavljen
26. 1. 2009.