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Glavni meni

IEC 61760-3:2010 ED1

Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering
16. 3. 2010.

Опште информације

99.60     3. 2. 2021.

WPUB   

IEC

TC 91

Međunarodni standard

31.190  

engleski   francuski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

IEC 61760-3:2010 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology.

Životni ciklus

TRENUTNO

POVUČEN
IEC 61760-3:2010 ED1
99.60 Povlačenje stupilo na snagu
3. 2. 2021.

REVIDIRAN OD

OBJAVLJEN
IEC 61760-3:2021 ED2