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Glavni meni

IEC 60191-6-5:2001 ED1

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
27. 8. 2001.

Опште информације

60.60     27. 8. 2001.

IEC

TC 47/SC 47D

Međunarodni standard

31.080.01  

engleski   španski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 60191-6-5:2001 ED1
60.60 Standard objavljen
27. 8. 2001.

REVIDIRAN OD

NAPUŠTEN
IEC 60191-6-5 ED2