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IEC 62047-18:2013 ED1

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
17. 7. 2013.

Опште информације

60.60     17. 7. 2013.

IEC

TC 47/SC 47F

Međunarodni standard

31.080.99  

engleski   francuski  

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Objavljen

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Apstrakt

IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 62047-18:2013 ED1
60.60 Standard objavljen
17. 7. 2013.