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Glavni meni

IEC 61191-1:2013 ED2

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
21. 5. 2013.

Опште информације

99.60     14. 9. 2018.

WPUB   

IEC

TC 91

Međunarodni standard

31.190     31.240  

engleski   francuski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

IEC 61191-1:2013 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. It also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition:
- reference standard IEC 61192-1 has been replaced by IPC-A-610;
- some of the terminology has been updated;
- references to IEC standards have been corrected;
- the use of lead-free alloys in the assembly have been added.

Životni ciklus

PRETHODNO

POVUČEN
IEC 61191-1:1998 ED1

TRENUTNO

POVUČEN
IEC 61191-1:2013 ED2
99.60 Povlačenje stupilo na snagu
14. 9. 2018.

REVIDIRAN OD

OBJAVLJEN
IEC 61191-1:2018 ED3