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IEC 61189-3-719:2016 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
5. 1. 2016.

Опште информације

60.60     5. 1. 2016.

IEC

TC 91

Međunarodni standard

31.180  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 61189-3-719:2016 ED1
60.60 Standard objavljen
5. 1. 2016.