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IEC 62148-21:2019 ED1

Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
11. 3. 2019.

Опште информације

99.60     22. 4. 2021.

WPUB   

IEC

TC 86/SC 86C

Međunarodni standard

33.180.20  

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Apstrakt

IEC 62148-21:2019 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.
Keywords: electrical interface of photonic integrated circuit (PIC) packages

Životni ciklus

TRENUTNO

POVUČEN
IEC 62148-21:2019 ED1
99.60 Povlačenje stupilo na snagu
22. 4. 2021.

REVIDIRAN OD

OBJAVLJEN
IEC 62148-21:2021 ED2

Nacionalna preuzimanja

SRPS EN IEC 62148-21:2019  
ISS

Aktivne optičke komponente i uređaji – Standardi za kućište i interfejs – Deo 21: Uputstvo za projektovanje električnog interfejsa PIC kućišta korišćenjem S-FBGA i S-FLGA

95.99   Povučen

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