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Glavni meni

IEC 61189-1:1997 ED1

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
22. 11. 2001.

Опште информације

60.60     27. 3. 1997.

IEC

TC 91

Međunarodni standard

31.180  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 61189-1:1997 ED1
60.60 Standard objavljen
27. 3. 1997.

ISPRAVKE / IZMENE

OBJAVLJEN
IEC 61189-1:1997/AMD1:2001 ED1