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Glavni meni

IEC 61189-2:1997 ED1

Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
10. 4. 1997.

Опште информације

99.60     30. 5. 2006.

IEC

TC 91

Međunarodni standard

31.180  

engleski   francuski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

Provides a catalogue of test methods representing methodologies and
procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.

Životni ciklus

PRETHODNO

POVUČEN
IEC 60249-1:1982 ED2

POVUČEN
IEC 60249-1:1982/AMD4:1993 ED2

POVUČEN
IEC 60249-1:1982/AMD1:1984 ED2

POVUČEN
IEC 60249-1:1982/AMD2:1989 ED2

POVUČEN
IEC 60249-1:1982/AMD3:1991 ED2

TRENUTNO

POVUČEN
IEC 61189-2:1997 ED1
99.60 Povlačenje stupilo na snagu
30. 5. 2006.

ISPRAVKE / IZMENE

POVUČEN
IEC 61189-2:1997/AMD1:2000 ED1

NAPUŠTEN
IEC 61189-2/AMD2 ED1

REVIDIRAN OD

OBJAVLJEN
IEC 61189-2:2006 ED2