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Glavni meni

IEC 61189-3:1997 ED1

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
27. 11. 2006.

Опште информације

99.60     9. 10. 2007.

IEC

TC 91

Međunarodni standard

31.180  

engleski   francuski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

Provides a catalogue of test methods representing methodologies and
procedures that can be applied to test materials used for
manufacturing interconnection structures (printed boards) and
assemblies. It mainly covers chemical, mechanical and electrical
test methods.

Životni ciklus

TRENUTNO

POVUČEN
IEC 61189-3:1997 ED1
99.60 Povlačenje stupilo na snagu
9. 10. 2007.

ISPRAVKE / IZMENE

POVUČEN
IEC 61189-3:1997/AMD1:1999 ED1

NAPUŠTEN
IEC 61189-3/AMD2 ED1

REVIDIRAN OD

OBJAVLJEN
IEC 61189-3:2007 ED2