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IEC 61190-1-1:2002 ED1

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
25. 3. 2002.

Опште информације

60.60     25. 3. 2002.

IEC

TC 91

Međunarodni standard

31.190  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 61190-1-1:2002 ED1
60.60 Standard objavljen
25. 3. 2002.