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IEC 61191-2:1998 ED1

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
28. 8. 1998.

Опште информације

99.60     5. 6. 2013.

IEC

TC 91

Međunarodni standard

31.240  

engleski   francuski  

Kupovina

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Jezik na kome želite da primite dokument.

Apstrakt

Prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).

Životni ciklus

TRENUTNO

POVUČEN
IEC 61191-2:1998 ED1
99.60 Povlačenje stupilo na snagu
5. 6. 2013.

REVIDIRAN OD

POVUČEN
IEC 61191-2:2013 ED2