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Glavni meni

IEC 61709:1996 ED1

Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion
17. 10. 1996.

Опште информације

99.60     24. 6. 2011.

IEC

TC 56

Međunarodni standard

31.020  

engleski   francuski   španski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

Gives guidance on the use of failure rate data for the reliability
prediction of components in electronic equipment. Reference
conditions for failure rate data are specified, so that data from
different sources can be compared. The reference conditions adopted
are typical of the majority of applications of components in
equipment (e.g. telecommunication use, data processing). In this
standard it is assumed that the failure rate used under reference
conditions is specific to the component i.e. it includes the effect
of complexity, technology of the casing, dependence on
manufacturers and the manufacturing process, etc.

Životni ciklus

PRETHODNO

POVUČEN
IEC 60863:1986 ED1

TRENUTNO

POVUČEN
IEC 61709:1996 ED1
99.60 Povlačenje stupilo na snagu
24. 6. 2011.

REVIDIRAN OD

POVUČEN
IEC 61709:2011 ED2