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Glavni meni

IEC 60191-6-3:2000 ED1

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
29. 9. 2000.

Опште информације

60.60     29. 9. 2000.

IEC

TC 47/SC 47D

Međunarodni standard

31.080.01  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 60191-6-3:2000 ED1
60.60 Standard objavljen
29. 9. 2000.