ISO 9455-17:2002

Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues

Datum objavljivanja: 9. 12. 2002.

95.99 Povučen 10. 1. 2024.

Опште информације

Trenutna faza: 95.99 Effective date: 10. 1. 2024.

Inicijator: ISO

Pripada: ISO/TC 44/SC 12

Vrsta: Međunarodni standard

ICS: 25.160.50

Jezik: engleski francuski

Kupovina

Status: Povučen

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Apstrakt

ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.
This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.

Životni ciklus

TRENUTNO

POVUČEN
ISO 9455-17:2002
95.99 Povučen
10. 1. 2024.

REVIDIRAN OD

NAPUŠTEN
ISO/PWI 9455-17

OBJAVLJEN
ISO 9455-17:2024

Nacionalna preuzimanja

SRPS EN ISO 9455-17:2012

ISS

Topitelji za meko lemljenje – Metode ispitivanja – Deo 17: Kombinovano ispitivanje površinske otpornosti na izolaciju i ispitivanje pomeranja ostataka topitelja usled elektrohemijskog delovanja

95.99 Povučen

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