Povučen
ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
POVUČEN
ISO 9453:2006
POVUČEN
ISO 9453:2014
95.99
Povučen
24. 9. 2020.
OBJAVLJEN
ISO 9453:2020