Povučen
ISO/TS 10303-1689:2014-02 specifies the application module for
Interconnect physical requirement allocation.
The following are within the scope of
ISO/TS 10303-1689:2014-02:
thermal isolation requirement definition;electrical isolation requirement definition;thermal isolation template for substrate design;electrical isolation template for substrate design;length tolerance on spacing requirement;allocation of an isolation requirement to a shield realized as part of an interconnect substrate.
POVUČEN
ISO/TS 10303-1689:2010
POVUČEN
ISO/TS 10303-1689:2014
95.99
Povučen
18. 12. 2018.
OBJAVLJEN
ISO/TS 10303-1689:2018