Objavljen
ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.
POVUČEN
ISO 9455-14:1991
OBJAVLJEN
ISO 9455-14:2017
90.93
Odluka o potvrđivanju standarda
4. 1. 2023.
Topitelji za meko lemljenje – Metode ispitivanja – Deo 14: Ocenjivanje prianjanja ostataka topitelja
60.60 Standard objavljen