Objavljen
ISO/TS 10303-1741:2018-11 specifies the application module for
Sequential laminate assembly design.
The following are within the scope of
ISO/TS 10303-1741:2018-11:
sequence of application of an embedded component;
sequence of material buildup or lamination;
support for embedded component location;
items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.
POVUČEN
ISO/TS 10303-1741:2014
OBJAVLJEN
ISO/TS 10303-1741:2018
90.93
Odluka o potvrđivanju standarda
14. 6. 2026.