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Glavni meni

naSRPS EN IEC 60749-20-1:2020

Poluprovodničke komponente - Metode mehaničkih i klimatskih ispitivanja - Deo 20-1: Rukovanje, pakovanje, obeležavanje i isporuka komponanata za površinsku ugradnju osetljivih na kombinovani uticaj vlažnosti i toplote lemljenja

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Опште информације

40.60     24. 11. 2023.



Evropski standard



IEC 60749-20-1:2019 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture-sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air. The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs that have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date. This edition includes the following significant technical changes with respect to the previous edition: - updates to subclauses to better align the test method with IPC/JEDEC J-STD-033C, including new sections on aqueous cleaning and dry pack precautions; - addition of two annexes on colorimetric testing of HIC (humidity indicator card) and derivation of bake tables.

Životni ciklus


SRPS EN 60749-20-1:2011


naSRPS EN IEC 60749-20-1:2020
40.60 Završetak javne rasprave
24. 11. 2023.

Povezani projekti

Identičan sa prEN IEC 60749-20-1:2023

Identičan sa IEC 60749-20-1:2019 ED2 IDENTICAL