Projects

Semiconductor devices - Performance evaluation of semiconductor processing components and inspection equipment - Part 1: Transmittance evaluation method of EUV pellicle

50.20   Proof sent to secretariat or FDIS ballot initiated: 8 weeks

Semiconductor devices - Performance evaluation of semiconductor processing components and inspection equipment - Part 3: Nano-scale wafer surface inspection method using UV light

40.20   DIS ballot initiated: 12 weeks

Semiconductor devices - Performance evaluation of semiconductor processing components and inspection equipment - Part 4: Evaluation methods for dimensional accuracy of laser dicing process

40.60   Close of voting

High-level test description table for development of production test programs

50.20   Proof sent to secretariat or FDIS ballot initiated: 8 weeks

Atmospheric and altitude correction

20.99   WD approved for registration as CD

Measuring equipment for electrical and electromagnetic quantities - Environmental aspects

50.60   Close of voting. Proof returned by secretariat

Open Charge Point Protocol (OCPP)

40.60   Close of voting

Open Charge Point Protocol 2.01

40.60   Close of voting

Open Charge Point Protocol 2.1

40.60   Close of voting

Open Charge Point Protocol 2.1

40.60   Close of voting

Interpretation of dissolved gas analysis (DGA) in natural and synthetic esters

50.60   Close of voting. Proof returned by secretariat

Composite insulated cross-arms with AC rated voltage greater than 1 000 V and DC voltage greater than 1 500 V – Definitions, design criteria, test methods and acceptance criteria

20.99   WD approved for registration as CD

Industrial networks - 5G Communication Technology - Part 1: Terms, definitions and fundamentals

40.60   Close of voting

Evaluation of hydrophobicity retention of polymeric insulating materials under high voltage stress with the dynamic drop test

40.20   DIS ballot initiated: 12 weeks

Semiconductor devices - Reliability test methods for vibration energy harvesters - Part 1: Mechanical reliability under shock

40.60   Close of voting

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements

40.20   DIS ballot initiated: 12 weeks

Representation of electrical and instrument objects in digital 3D plant models during engineering

10.99   New project approved

General requirements for tap adapter of capacitance graded bushing

20.99   WD approved for registration as CD