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Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method

60.60   Standard objavljen

TC 47 Saznaj više

Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method

60.60   Standard objavljen

TC 47 Saznaj više

Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency

60.60   Standard objavljen

TC 47 Saznaj više

Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere

60.60   Standard objavljen

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Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

60.60   Standard objavljen

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Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

60.60   Standard objavljen

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Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

60.60   Standard objavljen

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Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation

60.60   Standard objavljen

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Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)

60.60   Standard objavljen

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Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

60.60   Standard objavljen

TC 47 Saznaj više

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

60.60   Standard objavljen

TC 47 Saznaj više

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

60.60   Standard objavljen

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Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure

60.60   Standard objavljen

TC 47 Saznaj više

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure

60.60   Standard objavljen

TC 47 Saznaj više

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

60.60   Standard objavljen

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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

60.60   Standard objavljen

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Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

60.60   Standard objavljen

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Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods

60.60   Standard objavljen

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