Objavljen
IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
POVUČEN
IEC 61188-5-1:2002 ED1
OBJAVLJEN
IEC 61188-6-1:2021 ED1
60.60
Standard objavljen
23. 2. 2021.
Štampane ploče i sklopovi štampanih ploča – Dizajn i upotreba – Deo 6-1: Dizajn lemnih površina – Opšti zahtevi za lemne površine na štampanim pločama
60.60 Standard objavljen