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IEC 61188-5-1:2002 ED1

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
12. 7. 2002.

Опште информације

99.60     24. 2. 2021.

WPUB   

IEC

TC 91

Međunarodni standard

31.180     31.190  

engleski   francuski  

Kupovina

Zamenjen

Jezik na kome želite da primite dokument.

Apstrakt

Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

Životni ciklus

TRENUTNO

POVUČEN
IEC 61188-5-1:2002 ED1
99.60 Povlačenje stupilo na snagu
24. 2. 2021.

REVIDIRAN OD

OBJAVLJEN
IEC 61188-6-1:2021 ED1