Objavljen
IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.
OBJAVLJEN
IEC TR 62878-2-7:2019 ED1
60.60
Standard objavljen
20. 3. 2019.