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IEC 61189-2-808:2024 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
25. 4. 2024.

Опште информације

60.60     25. 4. 2024.

IEC

TC 91

Međunarodni standard

31.180  

engleski   francuski  

Kupovina

Objavljen

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Apstrakt

IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 61189-2-808:2024 ED1
60.60 Standard objavljen
25. 4. 2024.

Nacionalna preuzimanja

SRPS EN IEC 61189-2-808:2024  
ISS

Metode ispitivanja za električne materijale, štampane ploče i druge strukture i sklopove za međusobno povezivanje – Deo 2-808: Termička otpornost pribora pomoću metode termičkih prelaza

60.60   Standard objavljen

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