IEC TR 61760-3-1:2022 ED1

Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method

Datum objavljivanja: 17. 6. 2022.

Опште информације

Trenutna faza: 60.60 Effective date: 17. 6. 2022.

Inicijator: IEC

Pripada: TC 91

Vrsta: Tehnički izveštaj

ICS: 31.190

Jezik: engleski

Kupovina

Status: Objavljen

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Apstrakt

IEC TR 61760-3-1:2022(E) supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and provides guidelines for the design of printed circuit boards with solder paste surface printing method, including specific examples.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC TR 61760-3-1:2022 ED1
60.60 Standard objavljen
17. 6. 2022.