IEC TR 61760-5-1:2024 ED1

Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components

Datum objavljivanja: 31. 1. 2024.

Опште информације

Trenutna faza: 60.60 Effective date: 31. 1. 2024.

Inicijator: IEC

Pripada: TC 91

Vrsta: Tehnički izveštaj

ICS: 31.190

Jezik: engleski

Kupovina

Status: Objavljen

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Apstrakt

IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the scope of this document.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC TR 61760-5-1:2024 ED1
60.60 Standard objavljen
31. 1. 2024.