Objavljen
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
POVUČEN
IEC PAS 62171:2000 ED1
OBJAVLJEN
IEC 60749-16:2003 ED1
60.60
Standard objavljen
17. 1. 2003.