IEC 63378-2-1:2024 ED1

Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages

Datum objavljivanja: 22. 10. 2024.

Опште информације

Trenutna faza: 60.60 Effective date: 22. 10. 2024.

Inicijator: IEC

Pripada: TC 47/SC 47D

Vrsta: Međunarodni standard

ICS: 31.080.01

Jezik: engleski

Kupovina

Status: Objavljen

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Apstrakt

IEC 63378-2-1:2024 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.
This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.

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TRENUTNO

OBJAVLJEN
IEC 63378-2-1:2024 ED1
60.60 Standard objavljen
22. 10. 2024.