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IEC 60749-34:2004 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
10. 3. 2004.

Опште информације

99.60     28. 10. 2010.

IEC

TC 47

Međunarodni standard

31.080.01  

engleski   francuski   španski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed causing rapid changes of temperature. The power cycling test is complementary to high temperature operating life.

Životni ciklus

PRETHODNO

POVUČEN
IEC PAS 62206:2000 ED1

TRENUTNO

POVUČEN
IEC 60749-34:2004 ED1
99.60 Povlačenje stupilo na snagu
28. 10. 2010.

REVIDIRAN OD

OBJAVLJEN
IEC 60749-34:2010 ED2