0 Stavka
Moj nalog
Telefon: (011) 7541-421, 3409-301, 3409-335, 6547-293, 3409-310
E-mail: Prodaja standarda: prodaja@iss.rs Seminari, obuke: iss-edukacija@iss.rs Informacije o standardima: infocentar@iss.rs
Stevana Brakusa 2, 11030 Beograd
Glavni meni

IEC 60749-14:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
7. 8. 2003.

Опште информације

60.60     7. 8. 2003.

IEC

TC 47

Međunarodni standard

31.080.01  

engleski   francuski   španski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly.
Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Životni ciklus

PRETHODNO

POVUČEN
IEC 60749:1996 ED2

POVUČEN
IEC 60749:1996/AMD1:2000 ED2

POVUČEN
IEC 60749:1996/AMD2:2001 ED2

POVUČEN
IEC PAS 62184:2000 ED1

TRENUTNO

OBJAVLJEN
IEC 60749-14:2003 ED1
60.60 Standard objavljen
7. 8. 2003.