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IEC 60749-25:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
11. 7. 2003.

Опште информације

60.60     11. 7. 2003.

IEC

TC 47

Međunarodni standard

31.080.01  

engleski   francuski   španski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

Životni ciklus

PRETHODNO

POVUČEN
IEC 60749:1996 ED2

POVUČEN
IEC 60749:1996/AMD1:2000 ED2

POVUČEN
IEC 60749:1996/AMD2:2001 ED2

POVUČEN
IEC PAS 62178:2000 ED1

TRENUTNO

OBJAVLJEN
IEC 60749-25:2003 ED1
60.60 Standard objavljen
11. 7. 2003.