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IEC 60749-30:2005 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
10. 8. 2011.

Опште информације

99.60     17. 8. 2020.

WPUB   

IEC

TC 47

Međunarodni standard

31.080.01  

engleski   francuski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability.

Životni ciklus

PRETHODNO

POVUČEN
IEC PAS 62182:2000 ED1

TRENUTNO

POVUČEN
IEC 60749-30:2005 ED1
99.60 Povlačenje stupilo na snagu
17. 8. 2020.

ISPRAVKE / IZMENE

POVUČEN
IEC 60749-30:2005/AMD1:2011 ED1

REVIDIRAN OD

OBJAVLJEN
IEC 60749-30:2020 ED2