0 Stavka
Moj nalog
Telefon: (011) 7541-421, 3409-301, 3409-335, 6547-293, 3409-310
E-mail: Prodaja standarda: prodaja@iss.rs Seminari, obuke: iss-edukacija@iss.rs Informacije o standardima: infocentar@iss.rs
Stevana Brakusa 2, 11030 Beograd
Glavni meni

IEC 61188-5-3:2007 ED1

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
30. 10. 2007.

Опште информације

60.60     30. 10. 2007.

IEC

TC 91

Međunarodni standard

31.180  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

IEC 61188-5-3:2007 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design, and the land pattern dimensions.

This publication is to be read in conjunction with IEC 61188-5-1 :2002.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 61188-5-3:2007 ED1
60.60 Standard objavljen
30. 10. 2007.

REVIDIRAN OD

OBJAVLJEN
IEC 61188-6-2:2021 ED1

OBJAVLJEN
IEC 61188-6-3:2024 ED1