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IEC 60749-37:2008 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
30. 1. 2008.

Опште информације

99.60     12. 10. 2022.

IEC

TC 47

Međunarodni standard

31.080.01  

engleski   francuski  

Kupovina

Revidiran

Jezik na kome želite da primite dokument.

Apstrakt

Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.

Životni ciklus

PRETHODNO

POVUČEN
IEC PAS 62050:2004 ED1

TRENUTNO

POVUČEN
IEC 60749-37:2008 ED1
99.60 Povlačenje stupilo na snagu
12. 10. 2022.

REVIDIRAN OD

OBJAVLJEN
IEC 60749-37:2022 ED2